Chronically implantable neural interface

Description
Development of a fully integrated, wireless, flip-chip bonded neural interface for central and peripheral nervous system applications (e.g. for neuroprosthetics) with SiC/hydrogel encapsulation

Implications
Enable and revolutionize neuroprosthetic aids

aid veterans and improve living conditions

support high tech spin-offs (CKI/Bionic technologies)

study nervous system

Research Group Contacts
F. Solzbacher, R. A. Normann, R. Harrison, (G. Clark), K. Shenoy (Stanford), H. Oppermann, M. Klein, M, Toepper, R, Hahn (FhG IZM Berlin, Germany), K. Koch, S. Kammer (FhG IBMT, St. Ingbert, Germany)

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